CARSEM ANNOUNCES CHINA FACILITY PLANS

City of Industry, CA- March 19, 2002- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they recently signed a Memorandum of Understanding to construct a factory with Suzhou Industrial Park (SIP), which is located in the Shanghai, China region. The Suzhou Industrial Park is considered one of the top-ten industrial parks in Asia with an impressive list of high technology companies already located in the park including Philips, AMD, Siemens, Nokia, and Solectron.

The initial phase will be a 16K m² (172K ft²) world-class assembly and test facility on 60K m² (645K ft²) of land. The first phase of assembly and test services will be the introduction of Carsem's Micro and SO (Small Outline) family of packages plus mixed signal and RF testing services. Carsem will begin customer qualifications during the fourth quarter of 2002 and will be in full production by the first quarter of 2003. The second phase will begin in the first quarter of 2003 with the addition of the MLP (Micro Leadframe Package) family and an expansion of the wafer probe and final test services.

David Comley, Carsem's Group Managing Director, stated "we made the commitment to extend Carsem's manufacturing operations into China in order to help our customers better address the rapidly developing markets that are emerging there. It is obvious that there are tremendous growth opportunities for both Carsem and our customers and this will position us with the ability to service those needs."

Comley further stated, "We selected the Suzhou Industrial Park because of its strategic location and the fact it offers an excellent infrastructure to support high technology firms like Carsem. We found that the import, export, freight handling and overall services provided by SIP are quite impressive. That combined with the fact there are 25 local universities, 70 independent research firms and over 200,000 people with extensive technical skills made the selection relatively easy."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.