W.T. CHIM PROMOTED TO GENERAL MANAGER OF CARSEM TEST

City of Industry, CA- March 12, 2002- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that W.T. Chim was promoted to General Manager of Carsem Test. Chim has been with Carsem for over 18 years and for the past 11 years he was the Operations Manager for the Carsem (M) facility.

"Prior to this change our Test Organizations have been the responsibility of the respective General Managers of Carsem (M) and Carsem (S) facilities and over the past several years they both developed impressive resources in equipment, people and technology," said David Comley, Carsem's Group Managing Director. "As the industry continues to grow, our customers are placing more emphasis on full turnkey solutions and services including test program and hardware development for new devices. We are responding to these needs by establishing a consolidated Test Organization that is focused on providing an integrated approach to enhance our level of test services and technology both now and into the future. I am delighted Chim has taken on this responsibility and I have complete confidence his organization will be able to exceed these growing customer expectations."

"I am very excited and pleased to be given the opportunity to strengthen our Test Organization and ensure that our test technology and services matches that of our customers needs. I am confident our Carsem test team will provide our customers with world-class support and services, " stated W.T Chim.

S.M. Low is Strategic and Technology Development Manager for Test

In addition, S.M. Low is now the Strategic and Technology Development Manager for Test reporting to Chim. Low has been with Carsem since 1994 and was the Operations Manager of Test for the Carsem (S) facility. He has over 18 years experience and, prior to joining Carsem, he worked for Intel and Western Digital.

Chim stated, "S.M.'s role is to ensure that our new testers and support equipment match the needs of our customers, and to develop cost effective solutions. He will also be responsible to recruit and train additional engineers with the skills to develop test programs and hardware solutions in order to help reduce our customers time to market. I am confident we will establish Carsem as world class provider of full turnkey assembly and test solutions."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.