CARSEM PROMOTES RICK FLOWERS TO VICE PRESIDENT OF SALES.

City of Industry, CA- February 1, 2002- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today the promotion of Rick Flowers to Vice President of Sales for North America. Flowers joined Carsem in 1993 and was most recently Director of Sales for the Western Region. He has over 27 years experience in the semiconductor industry. Prior to joining Carsem, Flowers was Purchasing & Subcontracts Manager for GEC Plessey where he was responsible for the procurement and management of contract assembly and test services from a wide range of suppliers around the world. He also held similar Purchasing positions at SEEQ Technology and Ferranti Interdesign.

Gerry Blackholly is Director of Asian Sales and Customer Service

Carsem also announced today that Gerry Blackholly moved to a new position as the Director of Asian Sales and Customer Service and is now based in Carsem's factory headquarters located in Ipoh, Malaysia. Blackholly has been with Carsem for over 10 years and prior to his new position he was Carsem's Vice President of Sales for North America and Europe. He has over 32 years experience in the semiconductor industry and has held management positions at various companies located in Europe, Asia and the USA including Manufacturing Manager for Plessey Semiconductors and Subcontract Assembly Manager for GEC Semiconductors based in Hong Kong.

"I am very pleased to have these two experienced individuals on the Carsem team. Rick has done an absolutely outstanding job supporting our Western Region customers over the past several years and I am confident he will play a key role in growing our sales in North America. In response to the fact that many of our customers are now managing their contract assembly and test activities from various locations in Asia, we appointed Gerry to the new position of Director of Asian Sales and Customer Service. He has a proven track record in growing Carsem's sales and his extensive experience will allow us to significantly enhance our sales and customer support for customers based in Asia," stated David Comley, Group Managing Director of Carsem Malaysia.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.