CARSEM ADDS 8 LEAD OPTION TO TSOT PACKAGE

City of Industry, CADecember 4, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today they now offer the TSOT package in an 8 lead option which is an addition to the 5 and 6 lead options announced earlier this year. This package family, which meets JEDEC reference MO-193, has the same footprint as the SOT 23 but it is only 1.0 mm thick vs. the SOT has a thickness of 1.45 mm. The TSOT not only meets the need for applications requiring thinner profiles, it also has the added benefit of improving the thermal performance by approximately 10%.

Package in Demand
"Since we announced the TSOT in February this year, the demand for this package has continued to increase at a rapid pace. Carsem's customers are designing more and more new devices using this package family and expressed a strong need for this 8 lead option and I am pleased we now offer it. We have a strong commitment to being our customer's Technology Partner and will continue to invest in the development of new package technologies to meet their need for smaller, thinner, and thermally efficient devices," stated Gerry Blackholly, Carsem's Vice President of Sales and Marketing.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.