CARSEM SHIPPING FCOL™ BY THE MILLIONS

City of Industry, CA- June 5, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today they are now shipping very large volumes of their FCOL™ family of products.

FCOL™ (Flip Chip on Leadframe) is the process of flipping a bumped die onto a lead frame based package and then molding it using standard plastic package assembly processes. Carsem introduced the technology in late 1999 in order to allow their customers to fit a considerably larger die into a standard package plus significantly improve the device performance by reducing the electrical parasitics associated with wire bonds. It expected that these features provide a cost effective solution for many devices including applications requiring frequencies in excess of 10 GHz.

According to Gerry Blackholly, Carsem's Vice President of Sales and Marketing, "The FCOL has been very successful for several of Carsem's customers. We currently offer it in many of our leaded products as well as some of our MLP (Micro Leadframe Package) packages. Depending on the package, our customers have been able to fit a die size that is up to 4 times larger in area than a wire-bonded version with about a 60% reduction in electrical parasitics. In addition, we are delighted to announce that our product can withstand the stringent 2600 C solder shock test."

"Carsem's partner relationship with some of our key customers was instrumental in helping us bring this product into high volume production and we have clearly demonstrated this package technology is very effective. We began shipping production volumes in Q1 2000 and during the last few months we have produced several million units. The development of this package technology was quite a challenge for our R&D group and I am proud of how successful this product has become. Without a doubt Carsem has demonstrated we have a very mature product with outstanding quality, yields and reliability," stated David Comley, Group Managing Director of Carsem Malaysia.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.