CARSEM RECEIVES EXCELLENCE IN SERVICE AWARD FROM STMICROELECTRONICS.

City of Industry, CA- May 8, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today they recently received an Excellence in Service Award for calendar year 2000 from STMicroelectronics.

"The STMicroelectronics ASD & Discrete Division chose to recognize CARSEM for its outstanding performance all over the past year. CARSEM excelled in terms of quality, yields, as in term of on time delivery and overall responsiveness. On top of that they demonstrated a superior ability to achieve our time-to-volume requirements," stated Michel Dumont, Group Vice President Discrete & Standard IC's Products & General Manager - Discrete Division.

Liam Noone, Carsem's European regional sales director said, "this award was a team effort involving the full spectrum of both Carsem's and STMicroelectronics' staff. It is a true partner relationship. We look forward to growing the business together and plan to win again next year."

"Carsem has a long standing relationship with STMicroelectronics and this award speaks highly of our ability to provide high technology services to an industry leader. I am proud our team received this award because it demonstrates our commitment of providing the industry with quality services and building strong relationships with our customers." stated Carsem's group-managing director David Comley.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.