CARSEM ADDS TERADYNE'S CAYALYST-100

City of Industry, CA- March 13, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today the installation of several Teradyne Catalyst-100 testers is completed and are now running in the production mode.

The Catalyst testers are capable of testing the newer generation SOC (System-On-a-Chip) and SIP ( System-In-a-Package) devices for the telecommunications and wireless markets including products for Bluetooth™ and VLSI applications. The Catalyst is currently one of the dominate testers for the SOC market with test capabilities for DSL, wireless, microwave, and power management applications.

According to Gerry Blackholly, Carsem's Vice President of Sales and Marketing, "Carsem has been providing turn-key assembly and test services since 1975. Teradyne platforms are a significant portion of our portfolio of over 150 testers and include the A575, A565 and A567 mixed signal testers. We selected the Teradyne Catalyst-100 because of the ability to test a wide range of our customer's advanced mixed signal devices including some new Bluetooth™ products."

Carsem's Commitment:
Added David Comley, Group Managing Director of Carsem Malaysia, "The acquisition of these new Catalyst testers will allow us to provide our customers with a competitive time-to-market advantage for their new generation mixed signal products. We recognize that there is more to the test service than the purchase of new generation testers. We must also provide our customers with test program and hardware development services as well as a superior product engineering support infrastructure. Carsem will continue to make significant investments in both new test equipment as well as the development and training of our technical support staff."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.