CARSEM RECEIVES THE 2009 AWARD FOR BEST EXTERNAL MANUFACTURING AND TESTING FROM SKYWORKS

Ipoh, Malaysia -January 27, 2010-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received the 2009 award for Best External Manufacturing and Testing from Skyworks Solutions, Inc., an innovator of high reliability analog and mixed signal semiconductors enabling a broad range of end markets. The award is based on quality, commercial and technological merit as it aligns with Skyworks' supply chain requirements.

During Skyworks' Supplier Conference ceremony held on January 12, 2010, their Director of Global Sourcing and Logistics, Mr. Rick Dion, announced supplier award winners in various categories and Skyworks' Vice President of Worldwide Operations, Mr. Bruce Freyman, presented the Best Supplier Award to Mr. Bob Cabral, Carsem's Eastern Regional Sales Director.

"We congratulate Carsem on their outstanding support and service to Skyworks in 2009 and look forward to continuing to partner with Carsem as we meet the growing demand for our products," said Mr. Freyman.

"We are very proud of this achievement and are committed to strengthening our long standing relationship with Skyworks," stated Mr. Cabral.

Mr. Peter Yates, Carsem's Group Managing Director added, "We truly appreciate being awarded the '2009 Best Supplier award for Subcontract Manufacturing' from Skyworks. This is a very prestigious award coming from a world class company such as Skyworks. We will, of course, remain dedicated to partnering with our customers in order to assure our mutual future growth."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

About Skyworks
Skyworks Solutions, Inc. is an innovator of high reliability analog and mixed signal semiconductors. Leveraging core technologies, Skyworks offers diverse standard and custom linear products supporting automotive, broadband, cellular infrastructure, energy management, industrial, medical, military and mobile handset applications. The Company's portfolio includes amplifiers, attenuators, detectors, diodes, directional couplers, front-end modules, hybrids, infrastructure RF subsystems, mixers/demodulators, phase shifters, PLLs/synthesizers/VCOs, power dividers/combiners, receivers, switches and technical ceramics. Headquartered in Woburn, Mass., Skyworks is worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America. For more information, please visit Skyworks' Web site at www.skyworksinc.com.