CARSEM ANNOUNCES THE RESIGNATION OF SW WOO, CARSEM CHIEF OPERATING OFFICER AND THE APPOINTMENT OF IAIN MEIKLE AS VICE PRESIDENT OF MANUFACTURING

Scotts Valley, CA March 9th, 2009

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that Mr. SW Woo has resigned as Chief Operating Officer effective 1st April 2009 in order to pursue other interests. Mr. Woo will be on leave prior to his resignation.

Replacing Mr. Woo in the capacity of Vice President of Manufacturing will be Mr. Iain Meikle. Mr. Meikle has been in the industry for the past 25 years. He has spent the past year in the capacity of Vice President of Module Business Development in the Carsem Malaysia operations. Prior to the position at Carsem, Iain spent the past 10+ years as the Chief Operating Officer of Dynacraft in Penang, Malaysia.

Dynacraft and Carsem are both part of the Hong Leong Group of Companies.

Mr. Meikle will have responsibility for all aspects of manufacturing for the two manufacturing facilities located in IPOH, Malaysia as well as the manufacturing operation located in Suzhou, China.

Carsem's Managing Director, Mr. Peter Yates expressed his gratitude for the fine job Mr. Woo has done in Carsem over the past 5 years and extended his well wishes for his future endeavors.

Mr. Yates further states, "I am pleased to have Mr. Meikle take on the role of Vice President of Manufacturing. The next year ahead will be extremely challenging in our industry and our manufacturing activities will be a key focus area for our continued growth".

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, website : www.carsem.com.