FOR IMMEDIATE RELEASE
Carsem
Press Contact: : Rick Flowers
VP of World Wide Sales and Marketing
Telephone Number: +60 5 3123333
Fax Number: +60 5 3125333
Email Address: rflowers@carsem.com.my
Web site address: www.carsem.com
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CARSEM ANNOUNCES THE APPOINTMENT OF PETER YATES AS NEW MANAGING DIRECTOR
Scotts Valley, CA December 4, 2008 - Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that Mr. Peter Yates has joined the company as Managing Director. Mr. Yates will be replacing Mr. David Comley in the position of Managing Director. Mr. Comley will remain as the Group Managing Director of Malaysia Pacific Industries.
Mr. Yates is a veteran of the semiconductor industry with over 30 years experience in various senior management roles most recently with NXP/Philips and GEC Plessey Semiconductor. In his various roles within NXP/Philips and GEC Plessey Semiconductor, Mr. Yates had management responsibility for assembly and test operations located in Hong Kong, China, Philippines and Malaysia
Mr. Yates spent his early years in the industry in the wafer fab area and was the founding CEO of SSMC wafer foundry in Singapore.
Mr. Comley stated, " I am very pleased to have Peter join the Carsem team. He brings a wealth of knowledge not only in the assembly and test areas but also the wafer fab arena. In today's semiconductor environment, the lines between wafer fab and assembly are becoming increasingly blurred. Peter's experience in both areas will prove invaluable in the future growth of Carsem."
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site:
www.carsem.com.
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