CARSEM RECEIVES OUTSTANDING SUPPLIER AWARD FROM TOUCHSENSOR TECHNOLOGIES

Scotts Valley, CA- February 15, 2004-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced that they were presented with an Outstanding Supplier of the Year Award for calendar year 2004 from TouchSensor Technologies, LLC.

The award was presented by Greg Poissant, TouchSensor's Director of Quality, during a ceremony held at TouchSensor on February 10, 2005 and was based on Carsem's commitment to Quality, On-time Delivery and overall Customer Satisfaction.

Mr. Poissant stated, "Carsem was selected among 15 suppliers because of their dedication to providing an excellent product and world class delivery"

Rick Flowers, Carsem's Vice President of North America Sales, stated, "I am very pleased that TouchSensor chose Carsem for this prestigious award. This award reflects our commitment to providing our customers with quality services and building strong partnerships. We look forward to working with TouchSensor well into the future."

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About TouchSensor Technologies
TouchSensor designs and manufacturers touch-sensistive user-interface panels based on its patented Field-Effect technology. Companies choose TouchSensor's custom panels for their leading-edge designs on appliances, fitness machines, drink dispensers, and industrial products. A private company founded in 1996, TouchSensor was named a 2003 KPMG Illinois High Tech Award winner. The company's headquarters is located outside Chicago in Wheaton, Illinois. Web site: www.touchsensor.com.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.