INTERNATIONAL TRADE COMMISSION IN REVIEW PHASE OF PATENT LITIGATION

Scotts Valley, CA- February 4, 2005-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the International Trade Commission (ITC) is now in the final review phase of the investigation related to a complaint filed by Amkor Technology, Inc. on November 17, 2003. The complaint accused Carsem of infringing a total of 21 claims of Amkor's United States Patent Nos. 6,433,277, 6,455,356, and 6,630,728 by making, using, selling, offering for sale, and importing into the U.S. Carsem's MLP (Micro Leadframe Package) products.

On November 18, 2004 the Administrative Law Judge Honorable Charles E. Bullock issued an Initial Determination that Amkor's asserted claims were invalid, not infringed or both, and that no violation of Section 337 of the Tarriff Act of 1930 occurred. There were four claims found to be infringed but those same four claims were found to be invalid. There were also four other different claims that were found to be valid but Carsem was found to have not infringed. The result of this is that no exclusion order has been imposed on the importation of Carsem assembled MLP products into the United States and Carsem and its customers remain free to import.

On February 1, 2005 the ITC issued a Notice that it will conduct a complete review of the Administrative Law Judge's Initial Determination and extended the deadline for completing the investigation to March 31, 2005.

David Comley, Carsem's Group Managing Director, stated, "We are confident the ITC's final ruling will favor Carsem. This review is not unexpected and is part of the typical process followed by the ITC as a pre-requisite to the formal appeal process generally sought in the Court of Appeals for the Federal Circuit." Mr. Comley further stated, "The actual hearing in July last year took over four weeks and the evidence and testimony was extensive. After a thorough review of the evidence presented, the ALJ issued his Initial Determination citing, not just one, but multiple very strong prior art references rendering most of the 21 asserted claims invalid. Judge Bullock also found that those claims that were not found to be invalid (and some that were) were not infringed by Carsem. These findings by the ALJ, combined with several other findings, confirm Carsem's contention all along that we are using our own independently developed technology and we remain confident that Carsem will prevail."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.