CARSEM OFFERS REMOTE ACCESS TEST DEVELOPMENT

Scotts Valley, CA- January 18, 2005-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they now offer the ability to access Carsem's ATE (Automatic Test Equipment) systems via a direct VPN (Virtual Private Network) connection and a Carsem secured terminal client server. The high security link allows customers direct access to any of Carsem's tester platforms for the purpose of doing real time test program debug, product engineering and device performance analysis.

The capability provides customers with the ability to work remotely with the Carsem factory staff in performing test program development efforts and product engineering support on a wide variety of tester platforms including Credence, Eagle, LTX, and Teradyne systems. It also gives the ability to achieve a collaborative effort to resolve device specific test issues on a real time basis, which significantly improves time-to-market and reduces cycle times. In addition, Carsem recently established a dedicated test development lab at their S-site, which currently has a Credence ASL-1000 tester but will expand over time to include a wide variety of ATE systems based on customer demand.

According to Allan Calamoneri, Carsem's Vice President of Test Business Development, "One of the advantages of this remote access is that it allows us to establish direct tester links and communication between our customer's engineer and the Carsem test team which streamlines the product introduction process and learning curve dynamics associated with ramping products into production volumes. Another key advantage is that it maximizes the utilization of limited high cost capital resources."

David Comley, Group Managing Director, stated, "One of the greatest challenges today lies in the area of improving the time to market and reducing the cost of electrical test. Carsem is fully committed to providing our customers with an efficient test support infrastructure and tester resources needed to enhance the ability to bring new products to the market as quickly as possible and at an effective cost."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.