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printable page HEADLINE NEWS
FOR IMMEDIATE RELEASE
Carsem, Inc.
Press Contact: Paul Smith, Director of Marketing
Telephone Number: 831 438-6861
Fax Number: 831 438-6863
Email Address: psmith@carsem.com
Web site address: www.carsem.com

CARSEM ANNOUNCES NEW CHIEF OPERATING OFFICER

Scotts Valley, CA-21 October, 2003- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that Mr. SW Woo joined the company as the new Chief Operating Officer. Mr. Woo reports directly to David Comley, Carsem's Group-Managing Director, and he will be responsible for all operations at Carsem's two factories located in Ipoh, Malaysia and the new factory currently under construction in Suzhou, China.

Woo has over twenty years of experience in both the technical and managerial aspects of contract assembly and test services. Prior to joining Carsem he was the Managing Director and President of ChipPAC's factory located in Shanghai, China. Prior to that he held various managerial and technical positions with Intel, RCA, and AIT (Advanced Interconnect Technologies; formerly Hana Technologies/Swire Technologies).

David Comley stated, "I am delighted that S.W. joined our company. His extensive background and unique experience will bring new and exciting dynamics to the future growth of Carsem."

"Carsem is recognized as one of the world leaders in our industry. I look forward to working with the management team to further enhance and strengthen our position in the market," stated Mr. Woo.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

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