FOR IMMEDIATE RELEASE
Carsem, Inc.
Press Contact: Paul Smith, Director of Marketing
Telephone Number: 831 438-6861
Fax Number: 831 438-6863
Email Address: psmith@carsem.com
Web site address: www.carsem.com
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CARSEM'S GLENN KOSCAL RECEIVES JEDEC RECOGNITION AWARD
City of Industry, CA-October 22, 2002-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that Glenn Koscal, Director of Technical Sales, was recently presented a Chairman's Award by JEDEC.
The award was presented to Koscal for his leadership and contributions in chairing the JC-11.2 Design Guide Task Group for the new packaging technologies of Plastic Quad and Dual Inline Square and Rectangular No-Lead (QFP-N/SO-N) packages.
According to the chairman of JEDEC's JC-11 Committee, Martin G. Freedman, "Glenn's technical contributions to the other JC-11 Packaging Subcommittees represented invaluable insights from the manufacturing portion of the supply chain and drove the JEDEC standards to be the target for the world to achieve. His expert leadership and contributions to the JC-11 Committee is a tribute to his personal energies, technical knowledge and his company's commitment to standardization."
"I am really pleased to get the award," stated Koscal.Ê "Establishing the design standards for the QFN family of packages has been quite a challenge and a real team effort by some of the best in the industry. Carsem has been very supportive because we feel this package concept is gaining wide acceptance in the industry and is a significant break-through in IC packaging technology."
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.
About JEDEC
JEDEC is the leading developer of standards for the solid-state industry.Ê Almost 1800 representatives, appointed by some 275 JEDEC member companies, work together in 50 committees to meet the needs of every segment of the industry Ð manufacturers and users alike.Ê The standards generated by JEDEC are accepted throughout the world.Ê JEDEC is a sector of the Electronic Industries Alliance (EIA). Over 800 JEDEC standards are available on-line, at no charge.Ê To access these standards or obtain further information, log onto the JEDEC web page at www.jedec.org.
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