CARSEM ANNOUNCES SOT66x PACKAGE

City of Industry, CA-July 11, 2002-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today the introduction of their SOT66x package. The package is similar in construction to Carsem's MLPM (Micro Leadframe Package) family of packages and utilizes their COL (Chip On Leadframe) technology to allow for a maximum die size. The package provides a smaller footprint and lower profile than the SC70, which is the nearest size similar package. The footprint area of the SOT66x is 2.7 sq. mm and the thickness is 0.57 mm as compared to an area of 4.2 sq. mm and a thickness of 0.95mm for the SC70. The package meets MSL-1 (Moisture Sensitive Level One) at 260 degrees centigrade re-flow and is currently offered in a six lead version. Other lead counts will be available later this year.

MSL-1 is the classification of JEDEC standard J-STD-020 that guarantees unlimited shelf life for packages stored at standard temperatures in an uncontrolled humidity environment. This means the baking process step, often required prior to mounting the package on a printed circuit board, can be eliminated which results in a manufacturing cost savings.

SOT66x (left), SC70 (center) and 0.5mm pencil

Smaller World
David Comley, Carsem's Group Managing Director, stated, "the demand for smaller and smaller packages is causing us to develop creative new concepts to meet those needs. The evolution of this package is a direct result of the development and manufacturing experience we gained from the highly successful MLP Micro family." Comley further stated, "Carsem will continue to use our advanced micro packaging technologies and creative ideas to provide our customers with innovative solutions."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.