CARSEM ANNOUNCES CHINA FACILITY PLANS

City of Industry, CA-June 5, 2002-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they recently formed a company called Carsem Semiconductor-Suzhou Ltd., which is located in the Shanghai, China region. The new company is wholly owned by Malaysia Pacific Industries, a publicly traded company on the Kuala Lumpur Stock Exchange (MPIM).

The new company recently purchased 40K sq. m (430K sq. ft.) of land in the Suzhou Industrial Park with a two-year option to acquire and additional 20K sq. m. (215K sq. ft.). Plans are already in action for the construction of a 16K sq. m. (172K sq. ft.) world-class assembly and test facility. As was previously announced in March this year, the first phase of assembly and test services will be the introduction of Carsem's Micro and SO (Small Outline) family of packages plus mixed signal and RF testing services. Customer qualifications will begin during the first quarter of 2003 and the factory will be in full production by the second quarter of 2003. The new factory plans to add the MLP (Micro Leadframe Package) capability during the second quarter of 2003.

David Comley, Carsem's Group Managing Director, stated, "since we first announced our plans in March this year, a significant number of our customers have expressed a major interest in utilizing the technology and services that we plan to install in this new factory. The China market has tremendous growth potential and the need for increased China content is causing many companies to seek long-term solutions with their key suppliers. Carsem is fully committed to providing our customers with this strategically located full turn-key solution."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.