CARSEM AND ELLIPSIZ MICROFAB SIGN MOU FOR WAFER BUMPING

Partnership will benefit customers seeking total and seamless flip-chip packaging solutions

Singapore, [February 28, 2002] - Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they have signed a Memorandum of Understanding to form a wafer bumping partnership with Ellipsiz MicroFab, a wafer bumping company located in Singapore. The agreement will enable Carsem and MicroFab the ability to provide their customers with seamless flip-chip packaging solutions.

Wafer bumping is an integral part of flip-chip technology, which is gaining in importance as an advanced technology packaging solution for today's high speed, mobile applications. It dramatically reduces both the size and weight of an IC package, and provides excellent thermal and electrical performance. In some cases, flip-chip allows an area of silicon of up to three times larger to be packed into a standard IC package as compared to using wire bond technology. As a result, flip-chip technology is finding its way into the packaging industry using copper leadframe, organic, and ceramic substrates.

"We thought carefully as to whether Carsem should install its own wafer bumping capability into its facilities in Ipoh, Malaysia," said David Comley, Group Managing Director of Carsem. "It became clear to us as we saw bumped wafers from many sources over the past two years that the industry and its technology is still evolving. It is for this reason that we have chosen to align ourselves with a company whose business model demands that they are at the forefront of this emerging technology. We chose Ellipsiz Microfab because they give us the highest quality product, excellent service, have an aggressive technology roadmap and is located close to our factories."

Said Sim Swee Khee, President of Advanced Packaging Solutions, The Ellipsiz Group, "Carsem's customers include leading manufacturers of computer, communications and consumer electronic products. We are excited to be chosen as Carsem's wafer bumping partner. As we work together to meet the high demands of world-class customers, we will be continuously challenged to overcome technology barriers, and to keep deepening our expertise in this specialized area."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

About Ellipsiz MicroFab
Ellipsiz MicroFab is a Singapore-based wafer bumping foundry which provides cutting-edge flip-chip packaging solutions to customers in Japan, USA, Europe and Asia. Established in 1996, it is ISO 9001-certified. Its proprietary process technology is capable of fabricating breakthrough 80 micron pitch bumps, and state-of-the-art advanced packaging solutions such as System-in-Package (SiP) and wafer level chip scale packaging (WLCSP) for high-end electronic products. Ellipsiz MicroFab operates in a 50,000 sq ft facility in Singapore which includes class 100 and class 10k cleanrooms. More information on the company is posted on its website at www.microfabtech.com

The company is the wafer bumping arm of The Ellipsiz Group, a leading engineering and advanced packaging solutions provider to the semiconductor industry in Asia. The holding company, Ellipsiz Ltd., was listed on SGX in July 2000. Among its engineering solutions are the sale and support of semiconductor equipment and chemicals, turnkey failure analysis laboratories, and total chemicals management (TCM). It also offers advanced packaging services such as wafer bumping and System-in-Package manufacturing.

The Group has operations in Singapore, Malaysia, the Philippines, Taiwan, China and the USA. It had revenues of S$100m in its FY 2001 which ended in June 2001. More information on the Group is posted on its website at www.ellipsiz.com.