Transilica Inc. Selects Carsem As Strategic Partner
For Packaging and Test Services

City of Industry, Calif. [July 31, 2001] - Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today they have been selected as a strategic partner of Transilica Inc., an innovation leader in wireless silicon design.

Transilica has created the world's smallest system-on-chip solution to provide complete Bluetooth functionality, including flash memory. In addition, the company continues to research and develop technology in the 802.11 family and other short-range wireless technology.

According to Douglas Schertzer, Transilica's director of operations, Transilica selected Carsem as a packaging and test partner because the company provided the expertise, high-performance technology, and customer support needed to optimize the quality of Transilica's wireless solutions.

"We place primary importance on strategic partner relationships that can increase our products' quality and drive customer satisfaction," Schertzer said. "We look forward to a successful relationship with Carsem, as Transilica continues to develop its products for short-range wireless systems."

The winner of several industry awards, Carsem is recognized worldwide as a pioneer in the assembly and test services industry. The company has an extremely large package portfolio that includes the Micro Leadframe (MLP), System-in-Package (SiP), Flip Chip On Leadframe (FCOL™), and Small Scale Ball Grid Array (SSBGA), which are commonly used for high performance telecommunications and wireless applications. Carsem also provides turn-key test services using their mixed signal, digital, analog and RF tester platforms.

"This partnership further demonstrates that our technology and services are among the best in the world," said David Comley, Carsem's group-managing director. "Transilica's selection of Carsem as a strategic partner is an extreme honor."

About Transilica Inc.
Transilica Inc. is a rapidly growing fabless semiconductor company leading the innovation of system-on-chip wireless technology. Transilica has built a world class team of RF CMOS, ASIC, and integrated software design engineers developing low power wireless devices for headsets, phones, PDAs, notebooks, printers, keyboards, digital cameras and many other consumer and enterprise products. Founded in 1999, Transilica is headquartered in San Diego, CA with subsidiaries in Taiwan, Singapore and Tokyo. > The company's investors include SBVC, Smart Technology Ventures, Lakshmi Ventures, Gamelan Capital Fund, CDIB & Partners Investment Holding Corporation (f/k/a Southeast Asia Investment Holdings), R.O.C. Venture Company Ltd., Joinwin Investment Co. Ltd., Siliconware Investment Co. Ltd. Transilica's OneChipŠ, the world's smallest fully integrated Bluetooth system-on-chip solution, combines all Bluetooth components including the RF transceiver, baseband modem, microprocessor, SRAM and flash memory into one eight square millimeter BGA chip. OneChip also provides integrated serial port, USB or Codec interfaces.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.