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printable page HEADLINE NEWS
FOR IMMEDIATE RELEASE
Carsem, Inc.
Press Contact: Paul Smith, Director of Marketing
Telephone Number: 831 438-6861
Fax Number: 831 438-6863
Email Address: psmith@carsem.com
Web site address: www.carsem.com

LINFINITY AWARD FOR NEW PRODUCT DEVELOPMENT SUPPORT

City of Industry, CA- May 29, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today they recently received an award for Outstanding Support of New Product Development Efforts from Microsemi-Linfinity.

Mr. Kelly Jones, Division President of Microsemi-Linfinity stated, "this award was given to Carsem because of their outstanding support related to building engineering and qualification lots for many of our new RF and Power management products. Time-To-Market is critical in our industry and the customer service, engineering and production support teams at both the Carsem (S) and Carsem (M) factories did a great job."

"Carsem is dedicated to building strong relationships with our customers and providing them with the world's best support. This award from Microsemi-Linfinity clearly demonstrates our company team members are dedicated to working closely with our customers in providing the finest support service in the industry." stated David Comley, Carsem's Group-Managing Director.

"The customer service, engineering support and fast response time required to support Linfinity's new product introductions is a real challenge. We are proud of this Linfinity award because it acknowledges that our Carsem team has consistently met these challenges," stated Rick Flowers, Carsem's Western Regional sales director.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

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