CARSEM RECEIVES VENDOR OF THE YEAR AWARD FROM MELEXIS.

City of Industry, CA- May 22, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today they received the Vendor of the Year 2000 Award from Melexis Microelectronic Integrated Systems.

The award was signed by Melexis COO, Francoise Chombar and stated "Vendor of the Year 2000, in appreciation of excellent supplier performance of Carsem Semiconductor Assembly and Test, a reliable partner in Quality, Service, and On-Time-Delivery."

"Melexis appreciates the stable, co-operative and customer orientated policy of Carsem" Klaus Hermann, VP Quality Melexis Group, stated after scoring Carsem as "Excellent" and signing an advanced ÔQuality and Ship-To-Stock' agreement in March 2001.

Peter Bergmann, Director Operations Melexis GmbH added: "Carsem has provided a long term, high quality and delivery performance of innovative products which is essential for our automotive business. Based on this, we feel confident to reward Carsem as vendor of the year and to jump into a S-T-S partnership".

David Comley, Carsem's group-managing director, stated "we are very proud to receive this award because it clearly demonstrates that our quality standards and level of service allow us to provide Melexis with products that comply with the stringent demands of the automotive industry. We look forward to working with Melexis well into the future and are committed to providing the best quality and service in the industry."

"The level of technology, engineering support and quality systems required to support Melexis is a real challenge. This award from Melexis is recognition that our Carsem team has consistently met these challenges over many years of close liaison," Liam Noone, Carsem's European regional sales director.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

About Melexis
Melexis Microelectronic Integrated Systems N.V.(EASDAQ: MLXS) designs, develops, tests and markets advanced integrated semiconductor devices for the automotive industry. The company sells its products to a wide customer base of Original Equipment Manufacturers (OEM's) of Automotive equipment makers throughout the world. Melexis' main products are automotive microcontrollers, Hall (magnetic) sensor ICs, interface ICs for pressure and acceleration sensors, integrated silicon pressure sensor chips, application specific integrated circuits (ASICS) and contactless identification ICs (known as tags), in each case principally for automotive applications.