CARSEM AND DYNACRAFT RECEIVE SUPPLIER EXCELLENCE AWARD FROM ANALOG DEVICES.

City of Industry, CA- March 27, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, and Dynacraft International, a related company that is a supplier of lead frames, announced they each recently received an Overall Excellence Award from Analog Devices Inc. Group-managing director David Comley manages both Carsem and Dynacraft.

The ADI Supplier Award was based on an exacting supplier rating program. Among the factors that determined the recipients were, on-time delivery, cycle time, yield and quality in quantitative terms and responsiveness. Carsem was the only vendor among seven winners that provides turnkey packaging and test services and Dynacraft was presented an award for providing quality lead frames and services.

"Analog Devices chose to recognize both Carsem and Dynacraft because they represent exactly what we would want in a supplier," said Geoff Thomas, vice president, manufacturing and chairman of Analog Devices' Purchasing Council. "In order to retain our leadership in our industry, ADI needs to partner with companies who share our drive for the highest degree of quality and growth support."

David Comley, group-managing director stated, "I am very proud both Carsem and Dynacraft received this prestigious award from one of the industry leaders. This recognition speaks highly of our commitment towards providing the industry with quality services and building strong relationships with our customers. We look forward to continuing the relationship with ADI and expect to win again next year."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

About Analog Devices Inc.
With revenues of $772 million for the first quarter of fiscal 2001, Analog Devices is a leading manufacturer of precision high-performance integrated circuits used in analog and digital signal processing applications. The company is headquartered in Norwood, Massachusetts and employs approximately 9,800 people worldwide. It has manufacturing facilities in Massachusetts, California, North Carolina, Ireland, the Philippines, Taiwan and the United Kingdom. Analog Devices' stock is listed on the New York Stock Exchange and the company is included in the S&P 500 Index.