CARSEM ACHIEVES SAC LEVEL 1 CERTIFICATION

City of Industry, CA- January 30, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that both factories located in Ipoh, Malaysia achieved SAC Level 1 Certification from the Semiconductor Assembly Council. This certification adds to Carsem's current international quality standards of ISO-9001, ISO-14001 and QS-9000. Carsem's focus on its Quality Productivity Program (QPP), an extensive quality & training program that encompasses the 9000 employees at both Carsem (M) and Carsem (S) facilities, has proven to be the key to the continuous improvement in Carsem's quality systems.

Customer Advantage
"Many of our competitors have yet to achieve these certified quality standards. I am pleased we can provide our customers with this level of confidence in our ability to service their needs" stated Gerry Blackholly, Carsem's Vice President of Sales and Marketing.

Added David Comley, Group Managing Director of Carsem Malaysia, "This clearly demonstrates we are a leader in the industry. Carsem's SAC Level 1 Certification provides a competitive edge for both Carsem and our customers."

The Semiconductor Assembly Council (SAC) was formed in 1991 to establish a certification program for semiconductor subcontract assemblers' worldwide. SAC is a council of semiconductor subcontractors, manufactures and end users. The members endorse a common standard for quality systems and process control practices for assembly and test of semiconductor devices. The certification eliminates the need and expense for redundant certifications by other semiconductor suppliers and end users.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.