CARSEM INTRODUCES VERY THIN TSOT PACKAGE

City of Industry, CA- February 6, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today the introduction of their new TSOT package. In order to meet the growing need for smaller, thinner Micro-Packages, Carsem now offers the new TSOT package in both a 5 and 6 lead version. This package has the same footprint as the SOT 23 but it is only 1.0 mm thick vs. the SOT thickness of 1.45 mm. This new package meets JEDEC reference MO-193.

Thinner World
"We are pleased Carsem is one of the select few suppliers that can provide this very thin package. The TSOT not only meets the need for applications requiring thinner profiles, it also has the added benefit of improving the thermal performance by 10%. Carsem will continue to invest in the development of new package technologies to meet our customer's need for smaller, thinner, and thermally efficient devices," stated Gerry Blackholly, Carsem's Vice President of Sales and Marketing.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.