CARSEM TAPS SMITH AS DIRECTOR OF MARKETING

City of Industry, CA- January 23, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that Paul Smith has joined the company as Director of Marketing, based in the Scotts Valley, CA office. Smith has over 35 years experience in the semiconductor industry and was most recently Executive Vice President of Worldwide Marketing at ASAT, Inc.

Getting The Message Out
"I am very pleased Paul joined our Carsem team. His marketing and senior management experience will help us make the industry more aware of the advanced technologies we offer to our customers," stated Gerry Blackholly, Carsem's Vice President of Sales and Marketing.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.