News Archive

• Carsem's Copper Wirebonding Program in Full Production (Jul-01, 2008)
• Carsem Receives Richtek's Assembly Supplier of the Year Award for 2007 (May-21, 2008)
• Carsem Receives RDA Microelectronics Supplier Appreciation Award for 2007 (Feb-28, 2008)
• Carsem Receives Skyworks Solutions 2007 Special Recognition Award for Lifetime Partnership (Jan-31, 2008)
• Carsem Offers Strip Test for Sawn MLP Packages (Dec-27, 2007)
• Carsem Announces Appointment of Chief Technology Officer(CTO) (Jun-25, 2007)
• Carsem Receives Analog Device's Supplier Excellence Award for 2006 (Mar-29, 2007)
• Carsem Receives Richtek's Assembly Supplier of the Year Award for 2006 (Mar-21, 2007)
• Carsem Receives Microsemi Corporation's Supplier of the Year Award for 2006 (Feb-23, 2007)
• Carsem Announces Appointment of New General Manager of S-Site in Malaysia (Jan-25, 2007)
• Carsem Suzhou Receives SiGe Semiconductor's Assembly Supplier of the Year Award for 2005 (Aug-09, 2006)
• Carsem Receives Elmos Semiconductor Assembly Supplier Of The Year Award For 2005 (May-09, 2006)
• Carsem Receives Microsemi Corporation's Suppplier of the Year Award for 2005 (March-20, 2006)
• Carsem Announces Sales Group Reorganization (March-07, 2006)
• Carsem Receives Analog Devices' Supplier Of The Year Award For 2005 (February-27, 2006)
• Carsem Announces Appointment of New Director of Marketing (January-31, 2006)
• Carsem's China Factory Achieves ISO/TS 16949 Certification (January-24, 2006)
• Carsem Will Challenge ITC's Initial Determination (November-11, 2005)
• Carsem Announces International Trade Commission Issued Another Favourable Decision (September-29,2005)
• Carsem Offers Strip Test Capability (September-15,2005)
• Carsem Appoints New General Manager for S-Site Factory (September-13,2005)
• Carsem Selected by AUSTRIAMICROSYSTEMS as Primary Assembly & Test Supplier (September-08,2005)
• Carsem Announces International Trade Commission Extends Target Date to February 9, 2006 (August-08,2005)
• Carsem Doubles the Size of their Test Operation in Malaysia (June-01,2005)
• Carsem's China Factory Achieves ISO9001 Certification (May-03,2005)
• International Trade Commission Extends Target Date (Apr-07,2005)
• Carsem Receives Supplier Excellence Award from Analog Devices (Mar-16,2005)
• Carsem Receives Excellent Achievement Award from Elmos (Mar-10,2005)
• Carsem Opens Taiwan Sales Office (Mar-08,2005)
• Carsem Receives Outstanding Supplier Award From Touchsensor Technologies (Feb-15,2005)
• International Trade Commission in Review Phase of Patent Litigation (Feb-07,2005)
• Carsem Announces New General Manager for M-Site Factory (Jan-25,2005)
• Carsem Offers Remote Access Test Development (Jan-18,2005)
• Carsem Increases High-Density MLP Options (Jan-11,2005)
• Carsem Offers NiPdAu Plating Option (Nov-30,2004)
• Carsem Clarifies Patent Litigation Statements (Nov-29,2004)
• Carsem Prevails in their ITC Patent Litigation (Nov-18,2004)
• Carsem's Article by David Comley (Oct-29,2004)
• Carsem Hits Milestone of Shipping One Billion MLP's (QFN) (Oct-19,2004)
• Carsem's China Factory Holds Grand Opening Ceremony (Sep-28,2004)
• Carsem Announces an Optically Transparent MLP(QFN) (Sep-14,2004)
• Carsem Continues to Expand MLP(QFN) Capacity (Sep-09,2004)
• Carsem's China Facility Begins Shipping Production Volumes (Jul-13,2004)
• Carsem Announces New VP Of Test Business Development (Jun-08,2004)
• Carsem Recieves Special Achievement Award from Analog Devices (Mar-18,2004)
• Carsem Completes Construction of China Facility (Feb-03,2004)
• Carsem Announces New Chief Operating Officer (Oct-21,2003)
• Carsem Signs Technology MOU with STMicroelectronics (Oct-07,2003)
• Carsem Receives IS/TS 16949:2002 Quality Management Systems Certification (Jul-09,2003)
• Carsem Expands MLP Manufacturing Capacity (Jul-02,2003)
• Carsem's MLP Meets MSL-1 at 260°C (Apr-30,2003)
• Carsem Awards China Construction Contract to Sembcorp (Mar-19,2003)
• Carsem Expands SiP (System in Package) Capacity (Mar-06,2003)
• Carsem's Glenn Koscal Receives JEDEC Recognition Award (Oct-22,2002)
• Carsem Announces 8 Mils Pad Pitch Production Capability for FCOL™ (Sep-10,2002)
• Carsem's MLP/QFN Article (Aug-29,2002)
• Carsem Announces SOT66x Package (Jul-11,2002)
• Carsem Announces Ultra Thin MLP (Jul-02,2002)
• Carsem Receives Supplier Appreciation Award from Texas Instruments Malaysia (Jun-11,2002)
• Carsem Announces China Facility Plans (Jun-06,2002)
• Carsem & LTX Enable Testing of Microtune's Wireless Bluetooth Devices (Apr-03,2002)
• Carsem Announces China Factory Plans (Mar-19,2002)
• Chim promoted to General Manager of Carsem Test, Low is Strategic & Technology Development manager for Test (Mar-12,2002)
• Carsem & Ellipsiz Sign Wafer Bumping Agreement (Feb-28,2002)
• Flowers Promoted to VP Sales, Blackholly Director of Asian Sales (Feb-01,2002)
• Carsem Adds 8 Lead Option to TSOT Package (Dec-04,2001)
• Transillica Inc. Selects Carsem As Strategic Partner For Packagingand Test Services (July-31,2001)
• Carsem's SiP (System-in-Package) in Full Production (July-10,2001)
• Carsem Shipping FCOL™ by the Millions (June-5,2001)
• Linfinity Award for New Product Development Support (May-29,2001)
• Carsem Receives Vendor of the Year Award from Melexis (May-22,2001)
• Carsem Receives Excellence in Service Award from STMicroelectronics (May-8,2001)
• Carsem and Dynacraft ReceiveSupplier Excellence Award from Analog Devices (Mar-27,2001)
• Carsem adds Teradyne's CATALYST-100 (Mar-13,2001)
• Carsem's Mature Lead-Free Solution (Feb-20,2001)
• Carsem Achieves SAC Level 1 Certification (Feb-7,2001)
• Carsem Introduces Very Thin TSOT Package (Feb-6,2001)
• Carsem Taps Smith as Director of Marketing (Jan-23,2001)