Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The current offering, referred to as the X3 package, is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component. Carsem is currently in the process of registering the package outline with JEDEC's (Joint Electron Device Engineering Council) JC-11 Committee for Mechanical (Package Outlines) Standardization.