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CARSEM ADDS 8 LEAD OPTION TO TSOT PACKAGE
Posted on 4th December, 2001
City of Industry, CADecember 4, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today they now offer the TSOT package in an 8 lead option which is an addition to the 5 and 6 lead options announced earlier this year. This package family, which meets JEDEC reference MO-193, has the same footprint as the SOT 23 but it is only 1.0 mm thick vs. the SOT has a thickness of 1.45 mm. The TSOT not only meets the need for applications requiring thinner profiles, it also has the added benefit of improving the thermal performance by approximately 10%.
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Transilica Inc. Selects Carsem As Strategic Partner For Packaging and Test Services
Posted on 31st July, 2001
City of Industry, Calif. [July 31, 2001] - Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today they have been selected as a strategic partner of Transilica Inc., an innovation leader in wireless silicon design.
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CARSEM'S SiP (System-in-Package) IN FULL PRODUCTION
Posted on 10th July, 2001
City of Industry, CA- July 10, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today they are fully qualified and have been shipping production volumes of SiP (System-in-Package) solutions to several major customers for the past 12 months.
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CARSEM SHIPPING FCOL™ BY THE MILLIONS
Posted on 5th June, 2001
City of Industry, CA- June 5, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today they are now shipping very large volumes of their FCOL™ family of products.
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LINFINITY AWARD FOR NEW PRODUCT DEVELOPMENT SUPPORT
Posted on 29th May, 2001
City of Industry, CA- May 29, 2001- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today they recently received an award for Outstanding Support of New Product Development Efforts from Microsemi-Linfinity.
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