Carsem Receives Microsemi Corporation’s Best Supplier of the Year Award for 2010
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Ipoh, Malaysia – 22 June, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that, for the second year in a row, it has received Microsemi Corporation’s Best Supplier of The Year Award for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Microsemi’s supplier program that measures key metrics such as, on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology.
The award was presented by, Microsemi’s Supply Chain Manager, Mr. Don Peterson to Carsem Suzhou’s General Manager, T.W. Hee in a ceremony held at the Carsem Suzhou factory on May 25, 2011.
Mr. Peterson stated, “It is particularly noteworthy that Carsem’s outstanding support of Microsemi has earned them this second straight supplier award. It represents an important contribution to Microsemi’s continuing growth in our competitive industry.”
“Microsemi is one of our major business partners and we are very proud that our dedicated Caresm team has once again received the Best Supplier of the Year Award,” stated Mr. Hee.
Mr. Peter Yates, Carsem’s Group Managing Director added, “the Suzhou factory team has done an outstanding job in further strengthening our strong partner relationship with Microsemi’s dedicated staff and we are extremely pleased to receive this prestigious award for the second straight year. We will continue to stay focused on the strong relationship that we have developed with Microsemi well into the future.”
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.
Microsemi Corporation (Nasdaq:MSCC) offers the industry’s most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi’s products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at http://www.microsemi.com.
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