Carsem
Press Contact: : Albert Law
VP of World Wide Sales and Marketing
Telephone Number: +60 5 3123333
Fax Number: +60 5 3125333
Email Address: albertlaw@carsem.com
Web site address: www.carsem.com

Ipoh, Malaysia – March 24, 2010-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that an Administrative Law Judge (ALJ) has issued a Supplemental Initial Determination (ID) in Carsem’s on-going patent litigation with Amkor Technology in the U.S. International Trade Commission (ITC) in Washington, D.C., ITC Investigation No. 337-TA-501

Following the Commission’s Notice of Reversal and Remand that was issued in February this year, the ALJ has now determined that all of Amkor’s asserted patent claims are invalid, not infringed, and/or not enforceable at the ITC, and that Carsem has not violated Section 337 of the Tariff Act by importing the MLP products Amkor had accused of infringement.

The ALJ’s Supplemental ID will be reviewed by the full Commission, which is scheduled to render a final determination by July 20, 2010.

Peter Yates, Carsem’s Group Managing Director, stated, “We are extremely pleased with the ALJ’s latest determination and look forward to the Commission’s final determination in July.”

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

• Carsem Achieves ANSI-ESD S20.20 Certification Posted on 20th February, 2013
  
• Carsem Suzhou’s Change of Address Posted on 2nd January, 2013
  
• Carsem Receives International Rectifier’s Vendor Of The Year Award & OSAT Of The Year Award 2011 Posted on 3rd December, 2012
  
• Carsem’s Congratulates SiTime for its Lead on the Deloitte’s Fast 500 Award Posted on 27th November, 2012
  
• Carsem sets up Sales Office in Japan Posted on 9th November, 2012
  
• Carsem Announces New Vice President of Sales, North America Posted on 15th October, 2012
  
• Carsem hosts the 35th IEEE CPMT International Electronics Manufacturing Technology Conference (IEMT 2012) Posted on 3rd October, 2012
  
• Carsem announces today that the U.S. Court of Appeals for the Federal Circuit has reversed the U. S. International Trade Commission (ITC) decision in the ongoing patent litigation Posted on 24th August, 2012
  
• Carsem Suzhou Receives Microsemi’s Outstanding Supplier Award Posted on 22nd June, 2012
  
• Carsem Suzhou Granted The High Tech Enterprise Status Posted on 26th May, 2012