CARSEM OFFERS STRIP TEST CAPABILITY
Press Contact: : Albert Law
VP of World Wide Sales and Marketing
Telephone Number: +60 5 3123333
Fax Number: +60 5 3125333
Email Address: firstname.lastname@example.org
Web site address: www.carsem.com
Scotts Valley, CA -September 15, 2005 Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they now offer the ability to do strip testing of their High-Density Micro Leadframe Package (MLP) family using Micro Component Technology’s ( MCT’s) Tapestry SC Strip Test Handler.
Strip test is a method of performing final electrical testing of devices while they are still in a matrix format on the leadframe strip that is used in the assembly process. By using a 2D code mark that is unique for each leadframe strip the Tapestry handler has the ability of providing an electronic “map” of the good devices which can then be laser marked prior to being singulated from the leadframe strip. In addition, because the devices are in a large matrix format, strip testing provides the ability to test multiple devices simultaneously, which improves throughput and reduces the cost of test. This is significant because, depending on the package body size, a single strip can contain from about 170 devices up to around 770 devices.
The Tapestry SC handler takes advantage of the fact that the units in strip form are held in precise position and, coupled with the handlers advanced hardware and software design features, the test contactor alignment to the package land (lead) is highly accurate and repeatable. Because of this, the first pass final test yields for strip tested devices are significantly higher when compared to testing parts that have been singulated and tested in pick-and-place or gravity feed handlers.
According to Allan Calamoneri, Carsem’s Vice President of Test Business Development, “We have been working closely with MCT and some of our key customers on the implementation of this capability and it is clear that strip testing offers some tremendous advantages. Strip testing is not a panacea for testing devices but, when it makes good technical and economic sense, we have seen significant improvements in test yields, throughput, quality and overall lower costs. Additionally, strip test can provide enhanced process and data mining opportunities that have not previously been achieved with conventional test methods.”
Carsem MLP’s are QFN (Quad Flat No-leaded) and SON (Small Outline No-lead) type packages that are compliant to JEDEC’s MO220 and MO229 standards.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.
MCT is a leading manufacturer of test handling and automation solutions satisfying the complete range of handling requirements of the global semiconductor industry. MCT has recently introduced several new products under its Smart Solutions(TM) line of automation products, including Tapestry®, SmartMark(TM), SmartSort(TM), and SmartTrak(TM), which are designed to automate the back-end of the semiconductor manufacturing process. MCT believes it has the largest installed IC test handler base of any manufacturer, with over 11,000 units worldwide. MCT is headquartered in St. Paul, Minnesota, with its core manufacturing operation in Penang, Malaysia. MCT is traded on the OTC Bulletin Board under the symbol MCTI. For more information on the Company, visit its web site at www.mct.com.
- Carsem Achieves ANSI-ESD S20.20 Certification
Posted on 20th February, 2013
- Carsem Suzhou’s Change of Address
Posted on 2nd January, 2013
- Carsem Receives International Rectifier’s Vendor Of The Year Award & OSAT Of The Year Award 2011
Posted on 3rd December, 2012
- Carsem’s Congratulates SiTime for its Lead on the Deloitte’s Fast 500 Award
Posted on 27th November, 2012
- Carsem sets up Sales Office in Japan
Posted on 9th November, 2012
- Carsem Announces New Vice President of Sales, North America
Posted on 15th October, 2012
- Carsem hosts the 35th IEEE CPMT International Electronics Manufacturing Technology Conference (IEMT 2012)
Posted on 3rd October, 2012
- Carsem announces today that the U.S. Court of Appeals for the Federal Circuit has reversed the U. S. International Trade Commission (ITC) decision in the ongoing patent litigation
Posted on 24th August, 2012
- Carsem Suzhou Receives Microsemi’s Outstanding Supplier Award
Posted on 22nd June, 2012
- Carsem Suzhou Granted The High Tech Enterprise Status
Posted on 26th May, 2012