MLP

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MLP PACKAGES
Carsem's MLP (Micro Leadframe Package) is a family of JEDEC compliant QFN and DFN plastic packages. This near CSP package family is available in two versions.

The primary package offering is a sawn package. This is offered in a quad configuration (MLPQ) and a dual configuration (MLPD). Standard body sizes are available from 0.6x0.3 to 12x12. Specialized and custom body sizes are also available on 0.1mm body size increments. These packages are offered in a variety of package thickness profiles.(A complete list of open tool leadframe configuration and lead count is available upon request.)

Mechanically Singulated (Punched) package are also available. Carsem has tooled various package sizes for this package that are footprint compatible to some of the more popular sawn configurations. These packages are only available in a 1.00 max package thickness profile.

MLP's typically have an exposed die attach pad for improved thermal performance. However, we also offer non-exposed pad options for COL (Chip On Lead), FCOL™ and other special applications. Custom versions with leads fused to the die paddle and multi-die attach pads can also be provided. A full range of turnkey test solutions and services are available for this package family.

Availability

CLICK to view MLP Surface Mount User's Guide


MLP Quad/Dual
MLP Popular Tooled Package Sizes
Standard MLP-Dual
0.3 x 0.6 thru 5 x 6 mm
2 - 22 I/O
Standard MLP-Quad
2 x 2 thru 10 x 10 mm
6 - 72 I/O
Semi-Custom Packages Available in Selected 0.1 mm Body Size Increments
Footprint Compatible Packages
The terminals of these packages match the surface mount layouts of the following packages:
SOIC, SOT23, SC70 Packages
0402 & 0201 SMT Components
Typical Terminal Pitch (e)
1.27, 1.00, 0.95, 0.80, 0.65, 0.50, 0.40, 0.35 mm
Available Standard Package Profile Heights (A max)
1.0, 0.80, 0.65, 0.55, 0.50, 0.40, 0.32
For other package height requirements, contact your local Carsem Sales Office

Custom sizes are also available upon request.

Bill of Material

  MLPQ/D - EP MLPQ/D - COL MLPQ/D - FCOL
LeadframeCDA194 / C7025 / Eftec64T
Die Attach QMI 519 ABLESTIK 8006 N.A.
Wire Bond 0.8/0.9/1.0/1.3/2.0mil Au or Cu wire N.A.
Flipchip N.A. N.A. Flux
Mold cpdG770H series (Green)
Lead FinishMatte Tin / NiPdAu
MarkingLaser (For Marking capability Click - Sawn)
PackingCanister, Tube, Tray or Tape & Reel
Process Flow CFCS-MLP / CFCS-MLP-NiPdAu-CD CFCA-FC-MLP-CD-TINP
JEDEC Reference
(Typical)
MLPQ-EP : MO-220 (<3x3 : MO-255)
MLPD-EP : MO-229 (<3x3 : MO-252)

  MLPQ/DH-EP (Punched)
LeadframeC194
Die AttachSumitomo 1076DJ
Wire Bond1.0mil Au wire
Mold cpdE670 (Green)
Lead FinishMatte Tin Plate
Marking Laser (For Marking capability Click -Punch)
PackingTube, Tray or Tape & Reel
Process FlowCFCM-MLPDH/QH-STD
JEDEC Reference (Typical)MLPQ-EP : MO-220
MLPD-EP : MO-229

Package Performance

Reliability Data
Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20 Moisture/Reflow Sensitivity Classification
IPC-9701 for Board Level Reliability

Reference Specifications
Autoclave 1008 hours 121°C / 100% RH, 2 atm
Temp. Cycle 1000 cycles -65°C / +150°C
Thermal Shock 300 cycles -55°C / +125°C
Board Stress 2000 cycles -40°C / +100°C

Reliability & MSL Results
Please Contact Sales Office for Package Specific Results

Thermal Data
Please CLICK to view

Electrical Data
Please CLICK to view

Datasheet / Drawings

Datasheet
CLICK to view MLP Datasheet | Clear MLP Datasheet | X3 MLP Datasheet
CLICK to view MLP Surface Mount User's Guide

Drawings
CLICK to view Package Outline
MLPQ - (SAWN)MLPD - (SAWN)
MLPQ MLPD
MLPQH - (PUNCHED)MLPDH - (PUNCHED)
STANDARD 5X6
  CUCLIP | 5X6