Carsem offers a wide variety of leaded industry standard packages for the manufacturers of discrete devices, passives, and low lead count IC devices. Packages range from the very small SOT66x to the larger SOT23 package family.
The SOT66x offers the smallest footprint in this family of packages, This flat-lead package is only 1.66mm long by 1.66mm wide (lead tip to lead tip) with an overall height of 0.6mm.
Most Micro Packages are available in traditional and COL configurations. Some of these packages are also available in FCOL configurations.
* Also referred to as SOT323
Bill of Material
Reliability & MSL Results