Manufacturing Sites

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Manufacturing Sites
Hong Leong Group
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M Site

Founded in 1972, M-Site was acquired by Hong Leong Group in June 1984. The factory has a total floor space of 436,000 sq. ft. (40,500 m²). M-Site is focused on Assembly only and Final Electrical Test on the products is supported at S-Site.

 

Product Groups Assembled at M Site:

I.C.

SOIC & QSOP(150Mil), SOIC(300Mil), MSOP(3.0mm), SSOP(5.3mm), TSSOP(4.4mm)

MICRO

SC 70, SOT 23, TSOT, SOT66x

POWER

TO220, DDPAK, SOT223


S Site

S Site commenced operations in April,1992. The factory has a total floor space of 640,000 sq. ft. (60,000 m²). S-Site supports Assembly and Final Electrical Test for both M-Site and S-Site.

 

Product Groups Assembled at S Site:

MLP

QUAD, DUAL (Saw version)

SiP

System in Package

I.C.

PDIP(300 Mil), QSOP(300 Mil)

QFP

MQFP, LQFP


Carsem Suzhou

Carsem Suzhou, commenced production in July 2004. The factory has a total floor space of 600K sq. ft. (56,000 m²). Carsem Suzhou is focused on assembly and test for the MLP-Micro Leadframe Package (QFN Format) and Laminate products.

 

Product Groups Assembled at Suzhou:

MLP

QUAD, DUAL (Saw version)

SiP

System in Package

Laminate

LGA, BGA