Manufacturing Sites

About Us
Vision & Mission
Manufacturing Sites
Hong Leong Group
 

M Site

Founded in 1972, M-Site was acquired by Hong Leong Group in June 1984. The factory has a total floor space of 436,000 sq. ft. (40,500 M²). M-Site is focused on Assembly only and Final Electrical Test on the products is supported at S-Site.

 

Product Groups Assembled at M Site:

MLP

MICRO & High Density (Punch version)

I.C.

SOIC & QSOP(150Mil), SOIC(300Mil), MSOP(3.0mm), SSOP(5.3mm), TSSOP(4.4mm)

MICRO

SC 70, SOT 23, TSOT, SOT66x

POWER

TO220, DDPAK, SOT223


S Site

S Site commenced operations in April,1992. The factory has a total floor space of 640,000 sq. ft. (60,000 M²). S-Site supports Assembly and Final Electrical Test for both M-Site and S-Site.

 

Product Groups Assembled at S Site:

MLP

QUAD, DUAL (Saw version)

SiP

System in Package

I.C.

PDIP(300 Mil), PLCC, QSOP(300 Mil), TSSOP(6.1mm)

QFP

MQFP, LQFP


Carsem Suzhou

Carsem Suzhou, commenced production in July 2004. The factory has a total floor space of 175K sq. ft. (16,000 M²). Carsem Suzhou is focused on assembly and test for the MLP-Micro Leadframe Package (QFN Format).

 

Product Groups Assembled at Suzhou:

MLP

QUAD, DUAL (Saw version)