Carsem's patented FCOL (Flip Chip On Leadframe) is the process of flipping a bumped die onto a lead frame and then molding it using standard plastic package assembly processes. FCOL™ is available in standard packages such as MLP, SOT23, SC70, TSOT, QSOP and narrow body SOICs.

• Same package with up to 4X larger die
• MSL Level 1*
• 60% improvement in self-inductance and capacitance
• 15% lower thermal resistance
• 30x reduction in resistance vs wire bond
• Withstands 260°C solder shock test
• Ability to final test including RF

* Depending on body size

There are a wide range of applications for FCOL and some examples are :

• Wireless Devices
• Power Management Devices
• High-speed Network Devices

For more information please contact your local sales office