Description:- This job is to manage the overall functions of the in-house clinic & cafeteria.
Industrial Nurse cum Cafeteria Executive
December 28th, 2011Flooding in Thailand – No Impact on Carsem
October 31st, 2011Ipoh, Malaysia – 31 October, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that although the tragic flooding in Thailand has seriously inpacted certain sectors of the Semiconductor Industry, there will be no impact or disruption to its factories.
In these times, continuity of supply is an important consideration for Carsem customers. Carsem’s situation is as follows :
1. Carsem does not procure any direct or consumable material from Thailaind for its assembly and test.
2. The direct and consumable materials used in Carsem assembly and test are not manufactured in Thailand.
These 2 statements apply to ALL Carsem assembly and test facilities. thus, there will be no impact or disruption to its factories.
Carsem extends its thoughts and prayers to its Thai neigbours during these dire times.
Production Control Assistant
September 22nd, 2011Description-This job is respoonsible for monitoring the movement of work in progress and expedite materials to be shipped on time to assigned customers - 2 vacancies available.
Carsem Receives Exar’s Supplier of the Year Award
September 15th, 2011Ipoh, Malaysia – 14 September, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Exar Corporation’s FY2011 Supplier of The Year Award for assembly and test services that were provided by the Carsem factories located in Ipoh, Malaysia. The award is based several criteria including the quarterly scorecard performance, as well as effort and flexibility in terms of operations, quality, deliveries and cost indices.
Carsem Receives Microsemi Corporation’s Best Supplier of the Year Award for 2010
June 22nd, 2011Ipoh, Malaysia – 22 June, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that, for the second year in a row, it has received Microsemi Corporation’s Best Supplier of The Year Award for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Microsemi’s supplier program that measures key metrics such as, on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology.
The award was presented by, Microsemi’s Supply Chain Manager, Mr. Don Peterson to Carsem Suzhou’s General Manager, T.W. Hee in a ceremony held at the Carsem Suzhou factory on May 25, 2011.
Mr. Peterson stated, “It is particularly noteworthy that Carsem’s outstanding support of Microsemi has earned them this second straight supplier award. It represents an important contribution to Microsemi’s continuing growth in our competitive industry.”
“Microsemi is one of our major business partners and we are very proud that our dedicated Caresm team has once again received the Best Supplier of the Year Award,” stated Mr. Hee.
Mr. Peter Yates, Carsem’s Group Managing Director added, “the Suzhou factory team has done an outstanding job in further strengthening our strong partner relationship with Microsemi’s dedicated staff and we are extremely pleased to receive this prestigious award for the second straight year. We will continue to stay focused on the strong relationship that we have developed with Microsemi well into the future.” Read the rest of this entry »
Carsem Expanding Suzhou Factory MLP (QFN) Capacity
May 26th, 2011Ipoh, Malaysia – 25 May, 2011.
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are expanding their Suzhou, China factory size by an additional 40,000 square meters (430,000 square feet). The ground breaking for the new facility expansion commenced in Q1 2011 and production operations are expected to begin in Q1 2012. The expansion will bring the total factory size to 56,000 square meters (600,000 square feet) and will allow Carsem to increase their Suzhou factory Micro Leadframe Package (MLP) capacity from the current 5 million units per day to over 20 million per day. The new expansion will be used to meet the future needs of Carsem’s existing as well as new potential customers and will incorporate a major focus on copper wirebond expansion as well as the more traditional gold wirebond products.
Carsem Receives Richtek’s 2010 Best Supplier Award
February 22nd, 2011Ipoh, Malaysia – February 22, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Richtek’s 2010 Best Supplier Award in recognition of outstanding services that were provided by the Carsem factory located in Suzhou, China. The award is based on Richtek’s exacting standards in the areas of quality and customer support.
Read the rest of this entry »
Carsem’s W. L. Law Receives Best Industry Paper Award at IEMT Conference
December 23rd, 2010Ipoh, Malaysia – 15 December, 2010.
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that W. L. Law, Carsem’s R&D Manager, received the Best Industry Paper Award at the 34th International Electronics Manufacturing Technology (IEMT) Conference held in Melaka, Malaysia from November 30 through December 2, 2010. The conference was sponsored by the Institute of Electrical and Electronics Engineers (IEEE) and the Components, Packaging, & Manufacturing Technology (CPMT) Society and is held every two years.
Carsem Continues to Aggressively Expand MLP (QFN) Capacity
August 24th, 2010Ipoh, Malaysia – August 24, 2010 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are continuing to aggressively expand their MLP (QFN) manufacturing capacity in both their Ipoh, Malaysia and Suzhou, China factory locations and are now capable of producing over 11 million units per day. This capacity expansion in assembly is matched with an equal proportion of test capacity expansion.
Carsem Wins ITC Patent Litigation Case
July 22nd, 2010Ipoh, Malaysia – July 22, 2010 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it was determined by the International Trade Commission (ITC) that Carsem has not violated section 337 of the Tariff Act of 1930, 19 U.S.C. & 1377, in the on-going patent litigation with Amkor Technology regarding ITC’s Investigation No. 337-TA-501