Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world. Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 9,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur. The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices.
The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles 80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier
Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable.
ZERO DEFECTS QUALITY is the responsibility of every employee.
YOUR TECHNOLOGY PARTNER
Our motto, Your Technology Partner, reflects our strong belief that one of the key values in providing advanced technology and services is to establish a long-term partner relationship with our customers. The entire Carsem team is dedicated to supporting that belief.
MANUFACTURING SITES
M Site
Founded in 1972, it was acquired by Hong Leong Group, Malaysia in June 1984. The factory has a total floor space of 310,000 sq. ft. (28,800 M2) a work force of 3,500 employees and a planned future expansion of 120,000 sq. ft. (11,200 M2) in CY2003.
Product Groups Assembled at M Site:
 |
|
| MLP | MICRO |
| I.C. | PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) |
| MICRO | SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 |
| POWER | TO220, DDPAK, SOT223 |
S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future.
Product Groups Assembled at S Site:
|
|
| MLP | QUAD, DUAL |
| ARRAY | SSBGA, SSLGA, FTBGA, CBGA |
| I.C. | PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) |
| QFP | MQFP, LQFP, TQFP |
| SiP | System in Package |
Carsem Suzhou
The factory, located in the Suzhou Industrial Park, was completed in January 2004 and is 172K sq. ft. (16,000 M2) in size with a work force of 250 people. It has completed customer qualifications and is currently shipping production volumes, including final test services, of the MLP (Micro Leadframe Package) Quad and Dual family.
Product Groups Assembled in Suzhou:
|
|
| MLP | QUAD, DUAL |
Hong Leong Group
Founded in 1963, the Hong Leong Group www.hongleong.com has since become one of the largest conglomerates in Malaysia with activities that span the globe. Both locally and overseas, Hong Leong Group companies have a blue-chip reputation with listings on stock exchanges of Kuala Lumpur, Singapore, Hong Kong, Manila and Europe.
Core businesses firmly rooted in the key growth sectors ..... The Group's entrepreneurial and innovative spirit is shown clearly through its dominance in key growth sectors of the economy - financial services, manufacturing, distribution, property and infrastructure development.
Coupled with an extensive network of channels for easy customer access and delivery of quality products and services, the Group is well-positioned to meet demanding changes to customer needs of today.